Wet chemical processing chambers for processing microfeature workpieces

ABSTRACT

A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing liquid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing liquid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing liquid can flow between the first and second flow systems, and the processing component can impart a property to the processing liquid for processing a surface on a microfeature workpiece having submicron microfeatures.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a Divisional of U.S. patent application Ser. No.10/860,384, filed Jun. 3, 2004, and now pending, which claims priorityto U.S. Application Nos. 60/476,786; 60/476,333; 60/476,881; and60/476,776, all filed on Jun. 6, 2003. Each of the Applications listedabove, and their appendices, is incorporated herein by reference. U.S.Application No. 60/501,566 filed on Sep. 9, 2003 is also incorporatedherein by reference.

TECHNICAL FIELD

The present invention is directed toward apparatus and methods forprocessing microfeature workpieces having a plurality of microdevicesintegrated in and/or on the workpiece. The microdevices can includesubmicron features. Particular aspects of the present invention aredirected toward a wet chemical processing chamber having a fixed unitand a detachable unit that can be removed quickly for servicingcomponents within the chamber.

BACKGROUND

Microdevices are manufactured by depositing and working several layersof materials on a single substrate to produce a large number ofindividual devices. For example, layers of photoresist, conductivematerials, and dielectric materials are deposited, patterned, developed,etched, planarized, and otherwise manipulated to form features in and/oron a substrate. The features are arranged to form integrated circuits,micro-fluidic systems, and other structures. Wet chemical processes arecommonly used to form features on microfeature workpieces. Wet chemicalprocesses are generally performed in wet chemical processing tools thathave a plurality of individual processing chambers for cleaning,etching, electrochemically depositing materials, or performingcombinations of these processes. FIG. 1 schematically illustrates anintegrated tool 10 that can perform one or more wet chemical processes.The tool 10 includes a housing or cabinet 20 having a platform 22, aplurality of wet chemical processing chambers 30 in the cabinet 20, anda transport system 40. The tool 10 also includes lift-rotate units 32coupled to corresponding processing chambers 30 for loading/unloadingthe workpieces W. The processing chambers 30 can be rinse/dry chambers,cleaning capsules, etching capsules, electrochemical depositionchambers, or other types of wet chemical processing vessels. Thetransport system 40 includes a linear track 42 and a robot 44 that movesalong the track 42 to transport individual workpieces W within the tool10. The integrated tool 10 further includes a workpiece storage unit 60having a plurality of containers 62 for holding workpieces W. Inoperation, the robot 44 transports workpieces to/from the containers 62and the processing chambers 30 according to a predetermined workflowwithin the tool 10.

One concern of integrated wet chemical processing tools is that theprocessing chambers must be maintained and/or repaired periodically. Inelectrochemical deposition chambers, for example, consumable electrodesdegrade over time because the reaction between the electrodes and theelectrolytic solution decomposes the electrodes. The shape of consumableelectrodes accordingly changes causing variations in the electricalfield. As a result, consumable electrodes must be replaced periodicallyto maintain the desired deposition parameters across the workpiece. Theelectrical contacts that contact the workpiece also may need to becleaned or replaced periodically. To maintain or repair electrochemicaldeposition chambers, they can be removed from the tool 10 and replacedwith an extra chamber, or they can be serviced in-situ within the tool.

One problem with repairing or maintaining existing wet chemicalprocessing chambers is that the tool must be taken offline for anextended period of time to replace the electrodes or service othercomponents in the processing chambers 30. When the processing chamber 30is removed from the tool, a pre-maintained processing chamber 30 ismounted to the platform 22 at the vacant station. When the processingchamber 30 is serviced in-situ on the platform, the lift/rotate unit 32is generally moved out of the way and the operator reaches into theprocessing chamber 30 from above to repair or replace the componentswithin the chamber 30. For example, to replace consumable electrodes,the worn electrodes are disconnected from the chamber 30 and newelectrodes are then installed. This can be an extremely cumbersomeprocess because there is only a limited amount of space in the tool 10to access the lower portion of the chambers 30 where the electrodes arepositioned. After the chamber 30 has been repaired or replaced, therobot 44 and the lift-rotate unit 32 are recalibrated to operate withthe processing chamber.

The processes for replacing worn electrodes, servicing other componentsin-situ within the tool, or replacing a chamber with another chamberrequire a significant amount of time during which the tool cannotprocess workpieces. Moreover, the robot 44 and the lift-rotate unit 32are generally recalibrated to the repaired chamber after each repair;this is a time-consuming process that increases the downtime forrepairing or maintaining processing chambers. As a result, when only oneprocessing chamber 30 of the tool 10 does not meet specifications, it isoften more efficient to continue operating the tool 10 without stoppingto repair the one processing chamber 30 until more processing chambersdo not meet the performance specifications. The loss of throughput of asingle processing chamber 30, therefore, is not as severe as the loss ofthroughput caused by taking the tool 10 offline to repair or maintain asingle one of the processing chambers 30.

The practice of operating the tool 10 until at least two processingchambers 30 do not meet specifications severely impacts the throughputof the tool 10. For example, if the tool 10 is not repaired ormaintained until at least two or three processing chambers 30 are out ofspecification, then the tool operates at only a fraction of its fullcapacity for a period of time before it is taken offline formaintenance. This increases the operating costs of the tool 10 becausethe throughput not only suffers while the tool 10 is offline to replacethe wet processing chambers 30 and recalibrate the robot 44, but thethroughput is also reduced while the tool is online because it operatesat only a fraction of its full capacity. Moreover, as the feature sizesdecrease, the electrochemical deposition chambers 30 must consistentlymeet much higher performance specifications. This causes the processingchambers 30 to fall out of specifications sooner, which results inshutting down the tool more frequently. Therefore, the downtimeassociated with repairing and/or maintaining electrochemical depositionchambers and other types of wet chemical processing chambers issignificantly increasing the cost of operating wet chemical processingtools.

SUMMARY

The present invention is directed toward wet chemical processingchambers with quick-release detachable units that reduce the downtimefor repairing or maintaining processing components in the chamberscompared to existing wet chemical processing chambers. In severalembodiments of the inventive wet chemical processing chambers,processing components that require periodic maintenance or repair arehoused or otherwise carried by the detachable units. For example, anelectrode can be one type of processing component that is housed withina detachable unit. Such processing components can be quickly replaced bysimply removing the detachable unit from the chamber and installing areplacement detachable unit. The detachable unit is generally accessiblewithout having to move the lift-rotate units or detach the head assemblyof the chambers. The detachable unit can also be coupled to the chamberby a quick-release mechanism that is easily accessible. As such, thedowntime for repairing or maintaining electrodes or other processingcomponents in chambers is reduced by locating such components indetachable units that can be removed and replaced in only a few minutescompared to several hours for performing the same work on existing wetchemical processing chambers.

In one embodiment, a wet chemical processing chamber in accordance withthe invention comprises a fixed unit, a detachable unit releasablycoupled to the fixed unit, a seal contacting the fixed unit and thedetachable unit, and a processing component disposed in the fixed unitand/or the detachable unit. The fixed unit can have a first flow systemconfigured to direct a processing fluid through the fixed unit and amounting fixture for fixedly attaching the fixed unit to a platform ordeck of an integrated processing tool. The detachable unit can include asecond flow system configured to direct the processing fluid to and/orfrom the first flow system of the fixed unit. The seal has an orificethrough which processing fluid or liquid can flow between the first andsecond flow systems, and the processing component can impart a propertyto the processing fluid for processing a surface on a microfeatureworkpiece having submicron microfeatures.

Another aspect of the invention is an integrated tool for wet chemicalprocessing of microfeature workpieces. In one embodiment, the tool caninclude a frame and a mounting module carried by the frame. The mountingmodule can include a plurality of positioning elements and attachmentelements. In this embodiment, the wet chemical processing chamber canhave a fixed unit including a mounting fixture with a first interfacemember engaged with one of the positioning elements of the mountingmodule and a first fastener engaged with one of the attachment elementsof the mounting module. The mounting module is configured to maintainrelative positions between positioning elements such that a transportsystem for transporting workpieces to/from the wet chemical processingchamber does not need to be recalibrated when the processing chamber isreplaced with another processing chamber or when one detachable unit isreplaced with another detachable unit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic top plan view of a wet chemical processing tool inaccordance with the prior art.

FIG. 2 is a schematic view illustrating a wet chemical processingchamber in accordance with one embodiment of the invention.

FIG. 3 is a schematic view illustrating the operation of a wet chemicalprocessing chamber in accordance with an embodiment of the invention.

FIG. 4A is cross-sectional view schematically illustrating a wetchemical processing chamber in a detached configuration in accordancewith an embodiment of the invention.

FIG. 4B is a cross-sectional view schematically illustrating a wetchemical processing chamber in an assembled configuration in accordancewith an embodiment of the invention.

FIG. 5A is a top isometric view of a carriage for loading/unloading adetachable unit from a wet chemical processing chamber in accordancewith an embodiment of the invention.

FIG. 5B is a bottom isometric view of a carriage for loading/unloading adetachable unit of a wet chemical processing chamber in accordance withan embodiment of the invention.

FIG. 6 is a top plan view of a wet chemical processing tool including awet chemical processing chamber in accordance with another aspect of theinvention.

FIG. 7 is an isometric view of a mounting module for holding a wetchemical processing chamber in a wet chemical processing tool inaccordance with an embodiment of the invention.

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 7 of amounting module for carrying a wet chemical processing chamber inaccordance with an embodiment of the invention.

FIG. 9 is a cross-sectional view showing a portion of a deck of amounting module in greater detail.

FIG. 10 is a cross-sectional isometric view schematically illustrating awet chemical processing chamber carried by a mounting module of a wetchemical processing tool in accordance with an embodiment of theinvention.

DETAILED DESCRIPTION

As used herein, the terms “microfeature workpiece” or “workpiece” referto substrates on or in which microdevices are formed integrally. Typicalmicrodevices include microelectronic circuits or components, thin-filmrecording heads, data storage elements, microfluidic devices, and otherproducts. Micromachines or micromechanical devices are included withinthis definition because they are manufactured using much of the sametechnology as used in the fabrication of integrated circuits. Thesubstrates can be semiconductive pieces (e.g., doped silicon wafers orgallium arsenide wafers), nonconductive pieces (e.g., various ceramicsubstrates) or conductive pieces.

Several embodiments of wet chemical processing chambers for processingmicrofeature workpieces are described in the context of electrochemicaldeposition chambers for electrolytically or electrolessly depositingmetals or electrophoretic resist in or on structures of a workpiece. Thewet chemical processing chambers in accordance with the invention,however, can also be used for etching, rinsing, or other types of wetchemical processes in the fabrication of microfeatures in and/or onsemiconductor substrates or other types of workpieces. Severalembodiments of wet chemical processing chambers and integrated tools inaccordance with the invention are set forth in FIGS. 2-10 and thecorresponding text to provide a thorough understanding of particularembodiments of the invention. A person skilled in the art, however, willunderstand that the invention may have additional embodiments or thatthe invention may be practiced without several of the details of theembodiments shown in FIGS. 2-10.

A. Embodiments of Wet Chemical Processing Chambers

FIG. 2 schematically illustrates a wet chemical processing chamber 100that enables quick repair or replacement of components to reduce thedowntime for maintaining processing chambers. The processing chamber 100includes a wet chemical vessel 102 and a head 104. The vessel 102 iscarried by a deck 106 of a tool that can include several otherprocessing chambers (not shown) and a workpiece transport system (notshown) for automatically handling workpieces. The vessel 102 containsthe processing fluid and several components for directing the processingfluid or otherwise imparting properties to the processing fluid forprocessing a workpiece. The head 104 is carried by a lift-rotate unit108 that moves the head 104 to load/unload the workpiece and to positionthe workpiece at a processing site 109 within the vessel 102. When theprocessing chamber 100 is an electrochemical deposition station forelectroplating materials onto a workpiece, the vessel 102 typically hasa fluid flow system and at least one electrode, and the head 104typically includes a workpiece holder having a contact assembly with aplurality of electrical contacts configured to engage a conductive layeron the workpiece. When the processing chamber 100 is a cleaning chamberor other type of capsule, the vessel 102 includes a plurality of fluiddispensers for flowing a fluid across the workpiece and the head 104typically includes a workpiece holder. Suitable configurations of fluidflow systems, electrodes, and other processing components in the vessel102 are disclosed in U.S. application Ser. Nos. 09/804,696; 09/804,697;10/234,637; 10/234,982; 10/234,628; 10/234,442; 09/849,505; 09/866,391;09/866,463; 09/875,365; 09/872,151; and 10/295,302, all of which areherein incorporated by reference. Additionally, suitable workpieceholders are disclosed in U.S. Pat. No. 6,309,524 and U.S. applicationSer. Nos. 09/717,927; and 09/823,948, all of which are also hereinincorporated by reference.

The vessel 102 includes a fixed unit 110 mounted to the deck 106 and adetachable unit 120 carried by the fixed unit 110. The fixed unit 110can include a chassis 112, a first flow system 114, and a mountingfixture 116. The chassis 112 can be a dielectric housing that ischemically compatible with the processing fluid. The chassis 112, forexample, can be a high density polymer or other suitable material. Thefirst flow system 114 can be configured to provide the desired flow tothe processing site 109. In electrochemical deposition chambers, thefirst flow system 114 can be configured to provide a flow that has asubstantially uniform velocity in a direction normal to the workpiecethroughout the processing site 109. The mounting fixture 116 can beflanges or a ring projecting outwardly from the chassis 112 to engagethe top surface of the deck 106. The mounting fixture 116 can beconfigured to precisely locate the fixed unit 110 relative to the deck106 as explained in more detail below. The fixed unit 110 can furtherinclude a processing component 118 to impart a property to theprocessing fluid flowing through the fixed unit 110. For example, theprocessing component 118 can be an electric field shaping element thatshapes the electric field in the processing site 109, a filter, amembrane, a nozzle, or another type of fluid dispenser. The processingcomponent 118 can also be any combination of these types of structures.Suitable structures for first flow systems 114, mounting fixtures 116and processing components 118 for the fixed unit 110 are disclosed inU.S. application Ser. Nos. 09/872,151 and 09/804,697 incorporated byreference above.

The detachable unit 120 of the vessel 102 includes a container 122, asecond flow system 124 configured to direct the processing fluid toand/or from the first flow system 114 of the fixed unit 110, and aprocessing component 126 that imparts a property to the processingfluid. The second flow system 124 can include inlets and outlets todeliver processing fluid to the first flow system 114 and to receiveprocessing from the first flow system 114. The first and second flowsystems operate together to provide a desired flow of processing fluidat the processing site. The first and second flow systems 114 and 124can also be configured to provide a forward flow relative to theprocessing component 126. In a forward flow system, the processing fluidpasses the processing component 126 in the detachable unit 120 beforethe processing fluid reaches the processing site 109. The first andsecond flow systems can also be configured to provide a reverse flowpast the processing component 126. In a reverse flow configuration, theprocessing fluid passes the processing component 126 after theprocessing fluid has passed through the processing site 109.

The processing component 126 is disposed in the detachable unit 120. Theprocessing component 126 can be a filter, membrane, or electrode. Inaddition, the processing component 126 can be an electrode assemblyhaving a plurality of electrodes arranged in a concentric configurationor another configuration suitable for electroplating materials onto theworkpiece. In still other embodiments, the processing component 126 canbe a combination of filters, membranes, electrodes, dielectricpartitions between electrodes that define individual electrodecompartments, spray bars with a plurality of nozzles, paddle platers, orother components used to process microfeature workpieces. The processingcomponent 126 is generally a consumable component (e.g., a consumableelectrode), a component that collects particulate matter or otherundesirable constituents in the processing fluid to protect the surfaceof the workpiece (e.g., filters of membranes), or other components thatmay fail or need to be cleaned. The processing component 126 in thedetachable unit 120 is accordingly subject to regular maintenance orreplacement to maintain the performance of the processing chamber 100within predetermined specifications. Such processing components canaccordingly be quickly replaced with new or refurbished components bysimply replacing one detachable unit 120 with a replacement detachableunit without having to move the head 104 or the fixed unit 110.

The vessel 102 also includes a seal 130 to prevent leaking between thefixed unit 110 and the detachable unit 120. The seal is typicallypositioned between the fixed unit 110 and the detachable unit 120. Theseal 130 can include at least one orifice to allow the processing fluidto flow between the first flow system 114 in the fixed unit 110 and thesecond flow system 124 in the detachable unit 120. In many embodiments,the seal 130 is a gasket with a pattern of orifices to allow fluid toflow between the first and second flow systems 114 and 124. The seal 130or gasket is typically a compressible member that prevents liquid fromleaking between the various flow channels of the flow systems. The seal130 can also be made from a dielectric material that electricallyisolates different fluid flows as they flow between the first and secondflow systems 114 and 124. Suitable materials for the seal 130 includeVITON® closed cell foams, closed cell silicon, elastomers, polymers,rubber and other materials.

The vessel 102 also includes an attachment assembly 140 for attachingthe detachable unit 120 to the fixed unit 110. The attachment assembly140 can be a quick-release unit, such as a clamp or a plurality ofclamps, that guides the detachable unit 120 to a desired orientationwith respect to the fixed unit 110 and securely holds the detachableunit 120 to the fixed unit 110. The attachment assembly 140 can beconfigured to move from a first position in which the detachable unit120 is secured to the fixed unit 110 and a second position in which thedetachable unit 120 can be removed from the fixed unit 110. In severalembodiments, as the attachment assembly 140 moves from the secondposition to the first position, the attachment assembly 140 drives thedetachable unit 120 toward the fixed unit 110. This motion compressesthe seal 130 and positions the detachable unit 120 at a desired locationwith respect to the fixed unit 110. The attachment assembly 140 can be aclamp ring, a plurality of latches, a plurality of bolts, or other typesof fasteners.

FIG. 3 schematically illustrates the operation of the wet chemicalprocessing chamber 100 for repairing or maintaining processingcomponents in the detachable unit. Like reference numbers refer to likecomponents in FIGS. 2 and 3. A first detachable unit 120 a is removedfrom the fixed unit 110 after the flow system 124 a and/or theprocessing component 126 a in the first detachable unit 120 a no longermeet specifications. The seal 130 may also be removed, but this isoptional. A second detachable unit 120 b is then installed by aligningit with the fixed unit 110 and engaging the attachment assembly 140 withthe second detachable unit 120 b. The second detachable unit 120 b caninclude a flow system 124 b and processing components 126 b that are newor have been refurbished so that the processing chamber 100 can meet thespecifications required for processing microfeature workpieces.

One advantage of the processing chamber 100 illustrated in FIGS. 2 and 3is that components in need of repair or maintenance can be quicklyreplaced with new or refurbished components without shutting down theprocessing chamber 100 for a significant period of time. One detachableunit 120 can be quickly removed from the fixed unit 110, and then areplacement detachable unit 120 can be installed in only a matter of afew minutes. This significantly reduces the downtime for repairingelectrodes or other processing components compared to conventionalsystems that require the components to be repaired in-situ on the toolor require the entire chamber to be removed from the tool. Anotheradvantage of the processing chamber 100 is that the processingcomponents 126 in the detachable units 120 can be replaced from alocation that is easily accessible under the deck 106. As a result,there is no need to move either the fixed unit 110, the head 104, or thelift-rotate unit 108 to replace worn processing components. This furtherreduces the downtime for maintaining processing components because thehead 104 and lift-rotate unit 108 do not need to be repositioned withrespect to the fixed unit 110. Moreover, a workpiece transport systemthat delivers the workpieces to the head 104 and retrieves theworkpieces from the head 104 does not need to be recalibrated to theprocessing chamber 100 because the position between the head 104 andsuch a workpiece transport system is not changed. The significantreduction in downtime for replacing processing components provided bythe processing chamber 100 is expected to significantly increase theproductivity of the wet chemical processing tool compared to existingtools.

FIG. 4A is a cross-sectional view illustrating a vessel 402 inaccordance with an embodiment of the invention. The vessel 402 caninclude a fixed unit 410, a detachable unit 420, a seal 430, and anattachment assembly 440. The fixed unit 410 can include a chassis 412, afirst flow system 414 (shown schematically), and processing components418 (shown schematically). The detachable unit 420 can include acontainer 422, a second flow system 424 (shown schematically), andprocessing components 426 (shown schematically). The seal 430 can be agasket having an opening 431 to allow fluid to flow between the firstand second flow systems 414 and 424. The attachment assembly 440 can bea clamp ring.

The fixed unit 410 can further include a plurality of hangers 450arranged at a common radius with respect to a center line of the fixedunit 410 or in another pattern. The hangers 450 can include shoulders452 to hold the attachment assembly. For example, the attachmentassembly 440 can be a ring that springs radially outwardly to contactthe hangers 450 and rest on the shoulders 452 in an open position. Thefixed unit 410 further includes a beveled guide surface 453, a bearingring 454 above the beveled guide surface 453, and a seal surface 456.The guide surface 453 can be an annular surface or a series of arcuatesegments inclined upwardly with increasing radius. The bearing ring 454can be a metal ring having a bearing surface inclined upwardly withdecreasing radius. The bearing ring 454 can also be made from othermaterials that are typically harder than the material of the chassis412.

The detachable unit 420 can include a rim 460 having a lower surface 462and an upper surface 464. The lower surface 462 and the upper surface464 can be inclined upwardly with increasing radius. The upper surface464, more specifically, can be inclined at an angle to mate with theguide surface 453 of the fixed unit 410. The detachable unit 420 canfurther include a seal surface 466 configured to retain the seal 430,slide channels 467 a and 467 b, and a bottom surface 468.

The attachment assembly 440 can include a first rim 472 configured toengage the lower surface 462 of the detachable unit 420 and a second rim474 configured to engage the bearing surface of the bearing ring 454.The attachment assembly 440 can include a latch (not shown) or leverthat moves the ring radially inwardly and locks the ring into a fixedposition.

FIG. 4B illustrates the vessel 402 after the detachable unit 420 hasbeen attached to the fixed unit 410. In operation, the attachmentassembly 440 moves radially inwardly so that the first rim 472 engagesthe lower surface 462 of the detachable unit 420 and the second rim 474engages the bearing surface of the bearing ring 454. The radially inwardmotion of the first rim 472 along the lower surface 462 lifts thedetachable unit 420 upwardly toward the fixed unit 410. As thedetachable unit 420 moves upwardly, the upper surface 464 engages theguide surface 453 to position the detachable unit 420 at a desiredposition with respect to the fixed unit 410. The second rim 474 of theattachment assembly 440 moves radially inwardly along the inclinedsurface of the bearing ring 454 to clamp the seal 130 between the sealsurfaces 456 and 466. A lever (not shown) on the attachment assembly 440can be moved from an open position to a closed position to induce a hoopstress in the attachment assembly 440 for securely holding thedetachable unit 420 to the fixed unit 410.

The chamber can also include an assembly for loading/unloading thedetachable unit 120. FIG. 5A is a top isometric view of a carriage 500for installing and removing a detachable unit in a wet chemicalprocessing chamber in accordance with one embodiment of the invention.The carriage 500 can include a bracket 510 that mounts to the undersideof the deck 106 (FIG. 2) of the tool. The carriage 500 can furtherinclude guide rails 512 and an end stop 514. The guide rails 512 receivethe slide channels 467 a and 467 b (FIGS. 4A and 4B), and the end stop514 engages a mating rounded portion of the detachable unit 420. Inoperation, an operator slides the detachable unit 420 along the rails512 until the detachable unit engages the end stop 514.

FIG. 5B is a bottom isometric view illustrating additional aspects ofthe carriage 500. The carriage 500 can further include an actuator 520having a handle 522, a shaft 524, and lifters 526 that are moved by theshaft 524. The actuator 520 can further include a rod 528 connected tothe lifters 526 and positioned in a joint 529. The rotation of thehandle accordingly rotates the rod 528 within the joint 529 to raise andlower the lifters 526.

To install a detachable unit, the actuator 520 is moved to a firstposition as shown in FIG. 5B. The detachable unit is then inserted alongthe rails 512 as described above, and the actuator 520 is lifted. As theactuator 520 rotates upwardly (arrow R), the handle 522 passes through agap 530 in a bottom flange 531 of the bracket 510. The lifters 526accordingly engage the bottom surface 468 (FIG. 4B) and raise thedetachable unit upwardly toward the fixed unit. After reaching theraised position, the handle 522 slides axially along the shaft 524(arrow A) to position the handle on top of the flange 531. Referringback to FIG. 4B, the bevelled surfaces on the bottom of the supports 450initially align the detachable unit 420 with the fixed unit 410. Afterthe rim 460 of the detachable unit 420 passes the shoulders 452 of thesupports 450, the upper surface 464 of the detachable unit 420 and theguide surface 453 of the fixed unit 410 position the detachable unit 420into final alignment with the fixed unit 410. The attachment assembly440 can then be actuated to clamp the detachable unit 420 to the fixedunit 410. The carriage 500 accordingly makes it easier to remove andinstall the detachable unit 420.

B. Embodiments of Integrated Tools With Wet Chemical Processing Chambers

FIG. 6 is a top plan view showing a portion of an integrated tool 600 inaccordance with an embodiment of the invention. In this embodiment, theintegrated tool 600 includes a frame 610, a dimensionally stablemounting module 620 mounted to the frame 610, a plurality of wetchemical processing chambers 670, and a plurality of lift-rotate units680. The tool 600 can also include a transport system 690. The mountingmodule 620 carries the processing chambers 670, the lift-rotate units680, and the transport system 690. The wet chemical processing chambers670 in the tool 600 can include vessels having fixed units anddetachable units as described above with reference to FIGS. 2-5. Assuch, any of the embodiments of the wet chemical processing chambers 100and 400 can be the wet chemical processing chambers 670 in theintegrated tool 600.

The frame 610 of the tool 600 has a plurality of posts 611 andcross-bars 612 that are welded together in a manner known in the art.The mounting module 620 is at least partially housed within the frame610. In one embodiment, the mounting module 620 is carried by cross-bars612 of the frame 610, but the mounting module 620 can stand directly onthe floor of the facility or other structures in other embodiments.

The mounting module 620 is a rigid, stable structure that maintains therelative positions between the wet chemical processing chambers 670, thelift-rotate units 680, and the transport system 690. One aspect of themounting module 620 is that it is much more rigid and has asignificantly greater structural integrity compared to the frame 610 sothat the relative positions between the wet chemical processing chambers670, the lift-rotate units 680, and the transport system 690 do notchange over time. Another aspect of the mounting module 620 is that itincludes a dimensionally stable deck 630 with positioning elements atprecise locations for positioning the processing chambers 670 and thelift-rotate units 680 at known locations on the deck 630. In oneembodiment (not shown), the transport system 690 can be mounted directlyto the deck 630. In other embodiments, the mounting module 620 also hasa dimensionally stable platform 650 and the transport system 690 ismounted to the platform 650. The deck 630 and the platform 650 arefixedly positioned relative to each other so that positioning elementson the deck 630 and positioning elements on the platform 650 do not moverelative to each other. The mounting module 620 accordingly provides asystem in which wet chemical processing chambers 670 and lift-rotateunits 680 can be removed and replaced with interchangeable components ina manner that accurately positions the replacement components at preciselocations on the deck 630.

The tool 600 is particularly suitable for applications that havedemanding specifications which require frequent maintenance of the wetchemical processing chambers 670, the lift-rotate units 680, or thetransport system 690. A wet chemical processing chamber 670 can berepaired or maintained by simply detaching the chamber from theprocessing deck 630 and replacing the chamber 670 with aninterchangeable chamber having mounting hardware configured to interfacewith the positioning elements on the deck 630. Because the mountingmodule 620 is dimensionally stable and the mounting hardware of thereplacement processing chamber 670 interfaces with the deck 630, thechambers 670 can be interchanged on the deck 630 without having torecalibrate the transport system 690. This is expected to significantlyreduce the downtime associated with repairing or maintaining processingchambers 670 so that the tool can maintain a high throughput inapplications that have stringent performance specifications. This aspectof the tool 600 is particularly useful when the fixed unit 110 (FIG. 2)must be removed to repair the chamber.

The transport system 690 retrieves workpieces from a load/unload module698 attached to the mounting module 620. The transport system 690includes a track 692, a robot 694, and at least one end-effector 696.The track 692 is mounted to the platform 650. More specifically, thetrack 692 interfaces with positioning elements on the platform 650 toaccurately position the track 692 relative to the chambers 670 and thelift-rotate units 680 attached to the deck 630. The robot 694 andend-effectors 696 can accordingly move in a fixed, dimensionally stablereference frame established by the mounting module 620. The tool 600 canfurther include a plurality of panels 699 attached to the frame 610 toenclose the mounting module 620, the wet chemical processing chambers670, the lift-rotate units 680, and the transport system 690 in acabinet. In other embodiments, the panels 699 on one or both sides ofthe tool 600 can be removed in the region above the processing deck 630to provide an open tool.

C. Embodiments of Dimensionally Stable Mounting Modules

FIG. 7 is an isometric view of a mounting module 620 in accordance withan embodiment of the invention for use in the tool 600. In thisembodiment, the deck 630 includes a rigid first panel 631 and a rigidsecond panel 632 superimposed underneath the first panel 631. The firstpanel 631 can be an outer member and the second panel 632 can be aninterior member juxtaposed to the outer member. The first and secondpanels 631 and 632 can also have different configurations than theconfiguration in FIG. 7. A plurality of chamber receptacles 633 aredisposed in the first and second panels 631 and 632 to receive the wetchemical processing chambers 670 (FIG. 6).

The deck 630 can further include a plurality of positioning elements 634and attachment elements 635 arranged in a precise pattern across thefirst panel 631. The positioning elements 634 can be holes machined inthe first panel 631 at precise locations and with precise dimensions toreceive dowels or pins that interface with the wet chemical processingchambers 670 (FIG. 6). In other embodiments, the positioning elements634 can be pins, such as cylindrical pins or conical pins, that projectupwardly from the first panel 631 to be received by mating structures inthe wet chemical processing chambers 670. The deck 630 has a first setof positioning elements 634 located at each chamber receptacle 633 toaccurately position the individual wet chemical processing chambers atprecise locations on the mounting module 620. The deck 630 can alsoinclude a second set of positioning elements 634 near each receptacle633 to accurately position individual lift-rotate units 680 at preciselocations on the mounting module 620. The attachment elements 635 can bethreaded holes in the first panel 631 that receive bolts to secure thechambers 670 and the lift-rotate units 680 to the deck 630.

The mounting module 620 also includes exterior side plates 660 alonglongitudinal outer edges of the deck 630, interior side plates 661 alonglongitudinal inner edges of the deck 630, and endplates 662 and 664attached to the ends of the deck 630. The transport platform 650 isattached to the interior side plates 661 and the end plates 662 and 664.The transport platform 650 includes positioning elements 652 foraccurately positioning the track 692 (FIG. 6) of the transport system690 on the mounting module 620. The transport platform 650 can furtherinclude attachment elements, such as tapped holes, that receive bolts tosecure the track 692 to the platform 650.

FIG. 8 is a cross-sectional view illustrating one suitable embodiment ofthe internal structure of the deck 630, and FIG. 9 is a detailed view ofa portion of the deck shown in FIG. 8. In this embodiment, the deck 630includes bracing 640, such as joists, extending laterally between theexterior side plates 660 and the interior side plates 661. The firstpanel 631 is attached to the upper side of the bracing 640, and thesecond panel 632 is attached to the lower side of the bracing 640. Thedeck 630 can further include a plurality of throughbolts 642 and nuts644 that secure the first and second panels 631 and 632 to the bracing640. As best shown in FIG. 9, the bracing 640 has a plurality of holes645 through which the throughbolts 642 extend. The nuts 644 can bewelded to the bolts 642 to enhance the connection between thesecomponents.

The panels and bracing of the deck 630 can be made from stainless steel,other metal alloys, solid cast materials, or fiber-reinforcedcomposites. For example, the panels and plates can be made from Nitronic50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxyfilled with mica. The fiber-reinforced composites can include acarbon-fiber or Kevlar® mesh in a hardened resin. The material for thepanels 631 and 632 should be highly rigid and compatible with thechemicals used in the wet chemical processes. Stainless steel iswell-suited for many applications because it is strong but not affectedby many of the electrolytic solutions or cleaning solutions used in wetchemical processes. In one embodiment, the panels and plates 631, 632,660, 661, 662 and 664 are 0.125 to 0.375 inch thick stainless steel, andmore specifically they can be 0.250 inch thick stainless steel. Thepanels and plates, however, can have different thickness in otherembodiments.

The bracing 640 can also be stainless steel, fiber-reinforced compositematerials, other metal alloys, and/or solid cast materials. In oneembodiment, the bracing can be 0.5 to 2.0 inch wide stainless steeljoists, and more specifically 1.0 inch wide by 2.0 inches tall stainlesssteel joists. In other embodiments the bracing 640 can be a honey-combcore, a light-weight foamed metal or other type of foam, polymers, fiberglass or other materials.

The mounting module 620 is constructed by assembling the sections of thedeck 630, and then welding or otherwise adhering the end plates 662 and664 to the sections of the deck 630. The components of the deck 630 aregenerally secured together by the throughbolts 642 without welds. Theouter side plates 660 and the interior side plates 661 are attached tothe deck 630 and the end plates 662 and 664 using welds and/orfasteners. The platform 650 is then securely attached to the end plates662 and 664, and the interior side plates 661.

The mounting module 620 provides a heavy-duty, dimensionally stablestructure that maintains the relative positions between the positioningelements 634 on the deck 630 and the positioning elements 652 on theplatform 650 within a range that does not require the transport system690 to be recalibrated each time a replacement processing chamber 670 orlift-rotate unit 680 is mounted to the deck 630. The mounting module 620is generally a rigid structure that is sufficiently strong to maintainthe relative positions between the positioning elements 634 and 652 whenthe wet chemical processing chambers 670, the lift-rotate units 680, andthe transport system 690 are mounted to the mounting module 620. Inseveral embodiments, the mounting module 620 is configured to maintainthe relative positions between the positioning elements 634 and 652 towithin 0.025 inch. In other embodiments, the mounting module isconfigured to maintain the relative positions between the positioningelements 634 and 652 to within approximately 0.005 to 0.015 inch. Assuch, the deck 630 often maintains a uniformly flat surface to withinapproximately 0.025 inch, and in more specific embodiments toapproximately 0.005-0.015 inch.

D. Embodiments of Wet Chemical Processing Chambers

FIG. 10 is an isometric cross-sectional view showing the interfacebetween a wet chemical processing chamber 670 and the deck 630. Thechamber 670 can include the processing vessel 102 or 402 described aboveand a collar 672. The collar 672 and the vessel 102 can be separatecomponents that are connected together. In such cases, the collar 672can be made from a dimensionally stable material, such as stainlesssteel, fiber-reinforced materials, steel alloys, cast solid materials,or other suitably rigid materials. In other embodiments, the collar 672is integral with the vessel 102 and formed from a high-density polymeror other suitable material.

The collar 672 is one embodiment of a mounting fixture 116 (FIG. 2). Thecollar 672 includes a plurality of interface members 674 that arearranged in a pattern to be aligned with the positioning elements 634 onthe deck 630. The positioning elements 634 and the interface members 674are also configured to mate with one another to precisely position thecollar 672, and thus the chamber 670, at a desired operating location onthe deck 630 to work with lift-rotate unit 680 and the transport system690. The positioning elements 634 can be a set of precisely machinedholes in the deck 630 and dowels received in the holes, and theinterface members 674 can be holes precisely machined in the collar 672to mate with the dowels. The dowels can be pins with cylindrical,spherical, conical or other suitable shapes to align and position thecollar 672 at a precise location relative to the deck 630. The collar672 can further include a plurality of fasteners 675 arranged to bealigned with the attachment elements 635 in the deck 630. The fasteners675 can be bolts or other threaded members that securely engage theattachment elements 635 to secure the collar 672 to the deck 630. Thecollar 672 accordingly holds the processing vessel 102 at a fixed,precise location on the deck.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. Accordingly, the present invention isnot limited except as by the appended claims.

1. A processing system for wet chemical processing workpieces,comprising: a mounting module having a plurality of positioningelements; a wet chemical processing chamber supported on the mountingmodule, the wet chemical processing chamber comprising a fixed unit, adetachable unit, an attachment system and a processing site, wherein (a)the fixed unit has a first flow path configured to direct a processingliquid through the fixed unit, and a mounting fixture having a firstinterface member engaged with one or more of the positioning elements;(b) the detachable unit has a second flow path configured to direct theprocessing liquid to and/or from the first flow system of the fixed unitand a processing component that imparts a property to the processingliquid; (c) the attachment system releasably couples the detachable unitto the fixed unit, and (d) the processing site is configured to receivethe workpiece and is in the fixed unit or the detachable unit to contactthe workpiece with a portion of the processing liquid; a transportsystem on the mounting module for transporting the workpiece within theprocessing system, the transport system having a second interface memberengaged with one of the positioning elements.
 2. The system of claim 1wherein the mounting module further comprises a deck having a rigidfirst panel, a rigid second panel superimposed under the first panel,joists between the first and second panel, and bolts through the firstpanel, the joists and the second panel.
 3. The system of claim 1 whereinthe mounting module further comprises a deck having a rigid first panel,a rigid second panel juxtaposed to the first panel, and bracing betweenthe first and second panels.
 4. The system of claim 1 wherein: theprocessing component comprises an electrode in the detachable unit; andthe chamber further comprises a head having a workpiece holder includingelectrical contacts configured to hold a workpiece at the processingsite and engage a conductive layer on the workpiece.
 5. The system ofclaim 1, further comprising a seal between a first seal surface of thefixed unit and a second seal surface of the detachable unit.
 6. Thesystem of claim 1 with the processing component comprising an electrodein the detachable unit and a filter between the electrode and theprocessing site.
 7. The system of claim 1 wherein: the processingcomponent comprises an electrode in the detachable unit and a membranebetween the electrode and the processing site, wherein the membrane isconfigured to conduct electrical current; and the chamber furthercomprises (a) a head having a workpiece holder including electricalcontacts configured to hold a workpiece at the processing site andengage a conductive layer on the workpiece, and (b) a seal between aportion of the fixed unit and the detachable unit.
 8. A processingsystems for wet chemical processing workpieces, comprising: a mountingmodule having a plurality of positioning elements and attachmentelements; a wet chemical processing chamber supported on the mountingmodule, the wet chemical processing chamber comprising a fixed unit, adetachable unit, an attachment system, a processing site, and a headpositioned over the fixed unit; wherein (a) the fixed unit has a firstflow system configured to direct a processing liquid through the fixedunit and a mounting fixture having a first interface member engaged withone of the positioning elements and a first fastener engaged with one ofthe attachment elements; (b) the detachable unit has a second flowsystem configured to direct the processing liquid to and/or from thefirst flow system of the fixed unit and a processing component thatimparts a property to the processing liquid for processing a surface ofthe workpiece; (c) the attachment system releasably couples thedetachable unit to the fixed unit, and (d) the processing site isconfigured to receive the workpiece and is in the fixed unit or thedetachable unit to contact the workpiece with a portion of theprocessing liquid having the property imparted by the processingcomponent; (e) the head comprises a workpiece holder configured to holdthe workpiece at the processing site; and a transport system on themounting module for transporting the workpiece within the processingsystem, the transport system having a second interface member engagedwith one of the positioning elements and a second fastener engaged withone of the attachment elements.
 9. The system of claim 8 with the headincluding electrical contacts for holding a workpiece at the processingsite, and for engaging a conductive layer on the workpiece.
 10. Thesystem of claim 8 further comprising a seal between the fixed unit andthe detachable unit.
 11. A processing system for wet chemical processingof microfeature workpieces, comprising: a frame; a mounting module onthe frame, the mounting module having a plurality of positioningelements and attachment elements; a wet chemical processing chamber onthe mounting module, including: (a) a fixed unit having a first flowsystem configured to direct a processing liquid through the fixed unitand a mounting fixture for fixedly attaching the fixed unit to a supportsurface of a tool; (b) a detachable unit releasably coupled to the fixedunit, the detachable unit having a second flow system configured todirect the processing liquid to and/or from the first flow system of thefixed unit; (c) a seal between the fixed unit and the detachable unit toprevent processing liquid from leaking between the fixed unit and thedetachable unit, the seal having an orifice through which processingliquid can flow between the first and second flow systems; (d) aprocessing component disposed in the fixed unit and/or the detachableunit, wherein the processing component imparts a property to theprocessing liquid for processing a surface on a microfeature workpiecehaving submicron microfeatures; and a robot movable along the mountingmodule for carrying a workpiece within the processing system, the robothaving a second interface member engaged with one of the positioningelements and a second fastener engaged with one of the attachmentelements.
 12. The system of claim 11, further comprising a headpositioned over the fixed unit, wherein the head comprises a workpieceholder configured to hold the workpiece at the processing site.
 13. Thesystem of claim 11 with the processing component comprising an electrodein the detachable unit; and further comprising a head having a workpieceholder including electrical contacts configured to hold a workpiece atthe processing site and engage a conductive layer on the workpiece. 14.The system of claim 11 wherein: the processing component comprises anelectrode assembly having a plurality of independently operableelectrodes separated from each other by dielectric dividers, and theelectrode assembly being positioned in the detachable unit; and thechamber further comprises a head having a workpiece holder includingelectrical contacts configured to hold a workpiece at the processingsite and engage a conductive layer on the workpiece.
 15. The system ofclaim 11 wherein the processing component comprises a filter in thedetachable unit.
 16. The system of claim 11 wherein the processingcomponent comprises a membrane in the detachable unit, and the membranebeing configured to conduct electrical current across the membrane. 17.The system of claim 11, further comprising an attachment assembly havinga clamp ring configured to move radially inwardly from a first positionto a second position to clamp the detachable unit to the fixed unit. 18.A processing system, comprising: a deck; a plurality of positioningelements on the deck; a plurality of workpiece processors on the deck,with substantially each workpiece processor including: a first unitpositioned on the deck via one or more positioning elements; a secondunit attachable and separable from the first unit, with the first andsecond units forming a vessel for holding a processing liquid; at leastone attachment assembly for attaching the second unit onto the firstunit; a head including a workpiece holder; a head lifter attached to thehead for moving the head to a load/unload position, where a workpiece ismoved into and/or out of the workpiece holder, and to a processposition, where the workpiece holder is at least partially within thefirst unit; and a robot moveable to load and unload workpieces into andout of the workpiece holders of the processors.
 19. The processingsystem of claim 18 further comprising a process component in the firstand/or second units, with the process component comprising a filter or amembrane.
 20. The processing system of claim 18 further comprising anelectrode in the first and/or second unit, and with workpiece holderincluding electrical contacts for engaging a conductive layer on aworkpiece.